Silicon powder used in copper clad laminate industry has remarkable physical characteristics: three high - high insulation, high thermal conductivity and high thermal stability; III. low - low coefficient of thermal expansion, low dielectric constant and low raw material cost; Two resistance - acid and alkali resistance and wear resistance. With the improvement of the surface treatment conditions of silica, its compatibility with the resin system is improved. Therefore, the application of silica as a filler in copper clad laminate can not only reduce the cost, but also improve some properties of copper clad laminate (such as thermal expansion coefficient, bending strength and dimensional stability). In short, silica has advantages in mechanical properties, electrical properties, thermal properties and dispersion in the system.

Basic characteristics of soft composite silicon powder:

Soft composite silicon micro powder can be distinguished according to the following characteristics and matched according to customer requirements: