We provide a series of products to the field of electronic and electrical products, including crystalline silicon micro powder, molten silicon micro powder, soft composite silicon micro powder and spherical silicon micro powder. At the same time, relying on our testing and application experiments, we can provide customers with product improvement and combined use schemes according to personalized needs.

>Epoxy plastic sealant (EMC)

The electronic devices in electronic and electrical products are usually encapsulated with epoxy plastic sealant (EMC), and the filler components such as silicon powder can make the epoxy plastic sealant obtain high cost performance. The powder materials of crystalline silicon micro powder and molten silicon micro powder series products can be used as excellent fillers for conventional purposes.

Spherical silicon powder is widely used in high-end semiconductor device packaging because of its characteristics of high filling, high flow, low wear and low stress. In particular, the spherical silicon powder controlling coarse particles can also be used as epoxy plastic sealant for narrow gap packaging, filler for liquid packaging resin such as underfiller and globetop, and filler for various resin substrates.

In addition, with the miniaturization and integration of electronic products, the thermal management of electronic products is becoming more and more important. Rounded crystalline silicon powder can provide excellent thermal conductivity for fully encapsulated and high thermal conductivity epoxy plastic sealant.

>Copper clad laminate (CCL)

Copper clad laminate (CCL) is often used as the substrate for printed circuit boards in electronic and electrical products, and the addition of ultra-fine silicon powder as filler can improve the CTE, heat resistance and reliability of CCL.

Ultrafine crystalline silicon powder and soft composite silicon powder are general fillers for copper clad laminates; Molten silicon powder can be used as filler for lowdk copper clad laminate;

Spherical silicon powder can be used as high filling filler to provide excellent performance for lowdk copper clad laminate and IC carrier plate; Spherical silicon powder can be used as an ideal filler for high thermal conductivity copper clad laminates such as aluminum substrate.

>Printed circuit board ink

Printed circuit board ink is a necessary protective material for circuit boards. Ultrafine crystalline silicon powder can provide ideal scratch resistance, low coefficient of thermal expansion, chemical resistance and long-term reliability for circuit boards.

>Epoxy encapsulant

The capacitance, resistance and other devices in electronic and electrical products are encapsulated with epoxy encapsulant. Molten silicon powder is a common component of epoxy encapsulant.

>Electronic potting adhesive

Power supply and other components in electronic and electrical products are often sealed with epoxy or silicone electronic potting adhesive. Crystalline silicon micro powder, molten silicon micro powder and spherical silicon micro powder can be selected as potting adhesive filler according to various considerations such as thermal expansion coefficient, thermal conductivity, viscosity and cost. Spherical silicon powder is used for the sealing of power devices because of its high filling and cost-effective heat conduction function.

>Thermal interface material (TIM)

The miniaturization of electronic products makes thermal management necessary. Thermal interface material (TIM) can fill the air gap caused by the uneven contact surface of electronic product components, so as to improve the heat dissipation capacity. Thermal conductive gasket or thermal conductive silicone grease are common thermal interface materials, and high thermal conductive fillers such as crystalline silicon powder and spherical silicon powder are important components of thermal conductive gasket or thermal conductive silicone grease.